The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Jun. 19, 2015
Applicants:

National Research Council of Canada, Ottawa, CA;

Groupe Graham International Inc., Lachine, CA;

Inventors:

Arnold Kell, Ottawa, CA;

Sylvie Lafreniere, Montreal, CA;

Chantal Paquet, Ottawa, CA;

Patrick Malenfant, Orleans, CA;

Olga Mozenson, Ottawa, CA;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); H01Q 1/24 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); C09D 11/033 (2014.01); H01Q 1/38 (2006.01); H05K 3/10 (2006.01); H01Q 1/36 (2006.01); H01Q 1/22 (2006.01); C09D 11/38 (2014.01); C09D 11/08 (2006.01); C09D 11/14 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); C09D 11/033 (2013.01); C09D 11/08 (2013.01); C09D 11/14 (2013.01); C09D 11/38 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/24 (2013.01); H01Q 1/364 (2013.01); H01Q 1/38 (2013.01); H05K 1/095 (2013.01); H05K 3/105 (2013.01); H05K 3/1216 (2013.01); H05K 2201/0257 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/1136 (2013.01);
Abstract

A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C-Csilver carboxylate or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.1-10 wt % of a polymeric binder (e.g. ethyl cellulose) and balance of at least one organic solvent. Conductive traces formed with the molecular ink are thinner, have lower resistivity, have greater adhesion to a substrate than metal flake inks, have better print resolution and are up to 8 times less rough than metal flake inks. In addition, the shear force required to remove light emitting diodes bonded to the traces using Loctite 3880 is at least 1.3 times stronger than for commercially available flake-based inks.


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