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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10882957 B1

PDFFull Text
Date of Patent:
Jan. 05, 2021

Filed:

Jul. 27, 2018

Laminate, and element comprising substrate manufactured using same

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hye Won Jeong, Daejeon, KR;

Kyungjun Kim, Daejeon, KR;

Kyoung Hoon Kim, Daejeon, KR;

Chan Hyo Park, Daejeon, KR;

BoRa Shin, Daejeon, KR;

Seung Yup Lee, Daejeon, KR;

HangAh Park, Daejeon, KR;

JinHo Lee, Daejeon, KR;

MiRa Im, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Mark A Osele

Int. Cl.
CPC ...
B32B 43/00 (2006.01); B32B 7/06 (2019.01); C08G 73/10 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 3/16 (2006.01); C03C 17/34 (2006.01); B32B 17/06 (2006.01); B32B 27/06 (2006.01); B32B 7/02 (2019.01); B32B 37/26 (2006.01); H01L 31/02 (2006.01); H01L 31/18 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1067 (2013.01); B32B 3/16 (2013.01); B32B 7/02 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 17/064 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 37/26 (2013.01); B32B 43/006 (2013.01); C03C 17/3405 (2013.01); H01L 31/02 (2013.01); H01L 31/18 (2013.01); H01L 51/0024 (2013.01); H01L 51/0097 (2013.01); H01L 51/52 (2013.01); H01L 51/56 (2013.01); B32B 2037/268 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2255/26 (2013.01); B32B 2307/30 (2013.01); B32B 2307/402 (2013.01); B32B 2307/412 (2013.01); B32B 2307/748 (2013.01); B32B 2379/08 (2013.01); B32B 2457/00 (2013.01); B32B 2457/20 (2013.01); B32B 2457/202 (2013.01); B32B 2457/206 (2013.01); C03C 2218/355 (2013.01); H01L 2221/68318 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); Y10S 156/93 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1195 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/265 (2015.01); Y10T 428/31507 (2015.04); Y10T 428/31533 (2015.04); Y10T 428/31623 (2015.04); Y10T 428/31681 (2015.04); Y10T 428/31721 (2015.04); Y10T 428/31736 (2015.04);
Abstract

A method for producing a device substrate by obtaining a laminate comprising a carrier substrate with a first polyimide film disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film, applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the adhesive strength of the first polyimide to the second polyimide film decreases and separating the second polyimide film from the first polyimide film formed on the carrier substrate to obtain the device.

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