The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Oct. 16, 2019
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Mineo Shimotsusa, Machida, JP;

Shinya Iwahashi, Oita, JP;

Sadayoshi Sakuma, Yokohama, JP;

Ichiro Saito, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01); B41J 2/05 (2006.01); B41J 2/14 (2006.01); B41J 2/475 (2006.01); B41J 2/335 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04563 (2013.01); B41J 2/0458 (2013.01); B41J 2/04501 (2013.01); B41J 2/05 (2013.01); B41J 2/14088 (2013.01); B41J 2/33535 (2013.01); B41J 2/4753 (2013.01);
Abstract

A liquid ejection head and its manufacturing method are capable of reducing the thickness of a protective layer as compared to the traditional technique so as to efficiently transfer the heat energy generated by a heating resistance element to a droplet of liquid such as ink. To achieve this, power supply wirings are provided in the same layer below the heating resistance element.


Find Patent Forward Citations

Shimotsusa, Mineo. (2021). Liquid ejection head, method for producing liquid ejection head, and liquid ejection apparatus (U.S. Patent No. 10882314). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10882314

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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