The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Jul. 31, 2019
Applicant:

SR Packaging Inc. Taiwan Branch (Seychelles), Taichung, TW;

Inventor:

Chia-Ching Chen, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 1/02 (2006.01); B29C 49/22 (2006.01); B29C 49/50 (2006.01); B29L 31/00 (2006.01); B29C 49/06 (2006.01);
U.S. Cl.
CPC ...
B29C 49/22 (2013.01); B29C 49/50 (2013.01); B65D 1/0215 (2013.01); B65D 1/0284 (2013.01); B29C 49/06 (2013.01); B29L 2031/712 (2013.01);
Abstract

A blow-molded lamination container includes an outer layer and an inner layer. The outer layer has a bottom and an air-inletting seam. The air-inletting seam is disposed through the bottom of the outer layer, and is formed from a tapering opening by cooling shrinkage. The inner layer is disposed in the outer layer, is capable of being filled with a content and contracts with respect to the outer layer, and is not nipped within the air-inletting seam by the outer layer. A width of a widest portion of the air-inletting seam is at least twice greater than a width of a narrowest portion of the air-inletting seam. A manufacturing method for the blow-molded lamination container is also provided.


Find Patent Forward Citations

Chen, Chia-Ching. (2021). Blow-molded lamination container and manufacturing method thereof (U.S. Patent No. 10882240). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10882240

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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