The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10882234 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 05, 2021

Filed:

Dec. 12, 2019
Applicant:

Olympus Corporation, Hachioji, JP;

Inventors:

Yoshitaka Otsuka, Hino, JP;

Hiroshi Yonekubo, Hachioji, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/36 (2006.01);
U.S. Cl.
CPC ...
B29C 45/36 (2013.01);
Abstract

A mold includes: a fixed mold including a first mold plate; a movable mold including a second mold plate; and a molding cavity by combining the fixed mold and the movable mold with each other. At least one of the first and the second mold plates includes: a nest in a stepped pillar shape, the nest including a large diameter portion engaged in the insertion hole, and a small diameter portion in which a transfer surface to form an optical function surface of a molded product is formed; and an outer-diameter forming member in a stepped cylindrical shape, the outer-diameter forming member including a cylindrical portion arranged around the small diameter portion of the nest, and engaged in the insertion hole, and a flange portion in which a transfer surface to form an outer diameter portion of the molded product is formed.


Find Patent Forward Citations

Otsuka, Yoshitaka. (2021). Mold (U.S. Patent No. 10882234). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10882234

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