The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Apr. 22, 2019
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Sayaka Okabe, Kariya, JP;

Tohru Higuchi, Kariya, JP;

Tsuyoshi Arai, Kariya, JP;

Assignee:

DENSO CORPORATION, Aichi-pref., JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 33/12 (2006.01); B29C 45/28 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14065 (2013.01); B29C 33/12 (2013.01); B29C 45/28 (2013.01); B29C 45/14655 (2013.01); B29C 2045/14163 (2013.01); B29C 2045/14852 (2013.01); H01L 21/56 (2013.01);
Abstract

A second mold is divided into a recess-side mold portion, which includes a recess, and a remaining mold portion in a sliding direction of a movable pin, while a size of a gap between the recess-side mold portion and the remaining mold portion is adjustable. The second mold is configured to execute a first-mold-closing operation for contacting the recess-side mold portion to the first mold and thereafter a second-mold-closing operation for contacting the remaining mold portion to the recess-side mold portion. A distal end portion of the movable pin is configured to be placed into a non-contacting state, in which the distal end portion of the movable pin is not in contact with the workpiece, at a time of executing the first-mold-closing operation. The distal end portion of the movable pin is configured to contact the portion of the workpiece at a time of executing the second-mold-closing operation.


Find Patent Forward Citations

Loading…