The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Dec. 09, 2016
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Takashi Fujioka, Ehime, JP;

Yoshiki Takebe, Ehime, JP;

Masato Honma, Ehime, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 39/38 (2006.01); B29C 39/18 (2006.01); B29C 43/18 (2006.01); B29C 43/52 (2006.01); B29C 70/28 (2006.01); B32B 27/12 (2006.01); C08J 5/04 (2006.01); B29C 70/46 (2006.01); B29K 101/10 (2006.01); B29K 101/12 (2006.01); B29K 105/06 (2006.01); B29K 105/04 (2006.01);
U.S. Cl.
CPC ...
B29C 39/38 (2013.01); B29C 39/18 (2013.01); B29C 43/18 (2013.01); B29C 43/52 (2013.01); B29C 70/28 (2013.01); B29C 70/46 (2013.01); B32B 27/12 (2013.01); C08J 5/04 (2013.01); C08J 5/042 (2013.01); B29K 2101/10 (2013.01); B29K 2101/12 (2013.01); B29K 2105/04 (2013.01); B29K 2105/06 (2013.01); C08J 2300/22 (2013.01); C08J 2300/24 (2013.01);
Abstract

A method for manufacturing a structure material is a method for manufacturing a structure material that includes a thermoplastic resin, reinforced fibers, and voids. The method includes: a first process for arranging a structure precursor comprising the thermoplastic resin and the reinforced fibers in a mold with a surface temperature of 80° C. or less; a second process for raising the surface temperature of the mold up to a temperature at which a storage elastic modulus (G') of the structure precursor is less than 1.2×10Pa; a third process for lowering the surface temperature of the mold down to a temperature at which the storage elastic modulus (G′) of the structure precursor is 1.2×10Pa or more; and a fourth process for removing a structure material obtained after end of the third process from the mold.


Find Patent Forward Citations

Loading…