The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Nov. 29, 2017
Applicant:

Fukuda Metal Foil & Powder Co., Ltd., Kyoto, JP;

Inventors:

Nobuaki Morioka, Kyoto, JP;

Yuta Sasai, Kyoto, JP;

Eri Fukuda, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21B 1/40 (2006.01); B21B 3/00 (2006.01); B32B 15/20 (2006.01); C22F 1/08 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
B21B 1/40 (2013.01); B21B 3/00 (2013.01); B32B 15/20 (2013.01); C22F 1/08 (2013.01); H05K 1/09 (2013.01); B21B 2003/005 (2013.01); B32B 2457/08 (2013.01); H05K 1/0277 (2013.01); H05K 2201/0355 (2013.01);
Abstract

A hard rolled-copper foil which, when heated and laminated on an insulating resin base material, can exhibit excellent bend-resistance characteristics without increasing a final reduction ratio, which, being not prone to develop rolling marks, can maintain a low surface coarseness and can therefore be preferably used in a flexible printed wiring board having excellent high-speed transmission characteristics, which is not prone to softening at room temperature, and which provides excellent operation efficiency and foil passing property when being processed into a flexible printed wiring board after having been stored. A hard rolled-copper foil in which a crystal orientation density in a copper orientation is not less than 10, and a crystal orientation density in a brass orientation is not less than 20.


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