The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Apr. 17, 2019
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Kurt Allen Jenkins, Sammamish, WA (US);

Gary Russell McClary, Palisade, CO (US);

Lincoln Matthew Ghioni, Redmond, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H01L 23/552 (2006.01); H05K 1/16 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); B29C 64/10 (2017.01);
U.S. Cl.
CPC ...
H05K 9/0032 (2013.01); B33Y 80/00 (2014.12); H01L 23/552 (2013.01); H05K 1/0203 (2013.01); H05K 1/0218 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/16 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H05K 9/0024 (2013.01); B29C 64/10 (2017.08); B33Y 10/00 (2014.12); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H05K 1/0206 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/107 (2013.01);
Abstract

Printed circuit boards include conductive metallic paths, such as vias, traces, and pads on the printed circuit board. One or more metal additive structures are additively manufactured onto the printed circuit boards in a manner that forms a continuous weld with at least one of the conductive metallic paths. As a result, the metal additive structures are continuous with the printed circuit board and do not require separate attachment mechanisms (e.g., soldering or mechanical fastening). The metal additive structures may include shield cans, frames, antennas, or heat sinks for the printed circuit board, for example.


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