The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Mar. 09, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Seung Eun Lee, Suwon-si, KR;

Yong Hoon Kim, Suwon-si, KR;

Kyung Hwan Ko, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/642 (2013.01); H05K 1/0353 (2013.01); H05K 1/092 (2013.01); H05K 1/115 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10015 (2013.01);
Abstract

An electronic component embedded substrate includes a first electronic component; a first insulating material covering at least a portion of the first electronic component; a first wiring layer disposed on one surface of the first insulating material; a second electronic component disposed on the first wiring layer and connected to the first electronic component by the first wiring layer; and a second insulating material covering at least a portion of the second electronic component, wherein the at least a portion of the first electronic component is exposed from the other surface of the first insulating material, opposite to the one surface of the first insulating material.


Find Patent Forward Citations

Loading…