The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Nov. 02, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventor:

Kenji Furukawa, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 2/06 (2006.01); H01G 4/38 (2006.01); H05K 1/18 (2006.01); H03H 7/01 (2006.01); H05K 1/11 (2006.01); B60L 53/12 (2019.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H02J 50/12 (2016.01); H02J 7/02 (2016.01); H01G 4/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B60L 53/12 (2019.02); H01G 4/38 (2013.01); H03H 7/0115 (2013.01); H05K 1/0271 (2013.01); H05K 1/112 (2013.01); H05K 3/3442 (2013.01); B60L 2230/14 (2013.01); B60Y 2200/91 (2013.01); H01G 2/06 (2013.01); H01G 4/40 (2013.01); H02J 7/025 (2013.01); H02J 50/12 (2016.02); H05K 2201/09063 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01);
Abstract

A capacitor module that suppresses the occurrence of solder cracking includes a substrate having a first principal surface and a second principal surface opposite to each other in a thickness direction, and capacitor elements mounted on at least the first principal surface of the substrate, wherein the substrate has a first pad electrode solder-bonded to a first terminal electrode provided at one end side of the capacitor elements and a second pad electrode solder-bonded to a second terminal electrode provided at the other end side of the capacitor elements, and penetrating holes are provided at positions, which overlap a pair of boundary lines that define a boundary between at least a region between the first pad electrode and the second pad electrode and an outside of the region in a plan view, and pass through the substrate in the thickness direction.


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