The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Mar. 02, 2018
Applicant:
Flex Ltd., Singapore, SG;
Inventors:
Mark Bergman, Redwood City, CA (US);
Yolita Nugent, Chestnut Hill, MA (US);
Assignee:
Flex Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H01L 21/28 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/52 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); D03D 1/00 (2006.01); H05K 3/36 (2006.01); A41D 1/00 (2018.01); H01R 4/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); D03D 1/0082 (2013.01); H05K 1/038 (2013.01); H05K 1/0393 (2013.01); H05K 1/119 (2013.01); H05K 1/189 (2013.01); H05K 3/36 (2013.01); A41D 1/005 (2013.01); H01R 4/00 (2013.01); H05K 3/103 (2013.01); H05K 3/12 (2013.01);
Abstract
An interconnect component is configured as an adapter or interposer providing mechanical and electrical interconnects between conductive threads, such as those woven within fabrics, and electrical connection points, such as contact pads on a printed circuit board (PCB), a flexible printed circuit (FPC), and/or a rigid-flex circuit board.