The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Mar. 22, 2017
Applicant:

Nokia Technologies Oy, Espoo, FI;

Inventors:

Xiang Xu, Nanjing, CN;

Srinivasan Selvaganapathy, Bangalore, IN;

Tsunehiko Chiba, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04W 4/24 (2018.01); H04L 5/00 (2006.01); G06F 7/10 (2006.01); H04L 12/14 (2006.01); H04M 15/00 (2006.01); G06Q 20/40 (2012.01); G06Q 20/14 (2012.01); G06Q 20/32 (2012.01); H04W 84/04 (2009.01);
U.S. Cl.
CPC ...
H04W 4/24 (2013.01); G06F 7/10 (2013.01); G06Q 20/145 (2013.01); G06Q 20/325 (2013.01); G06Q 20/405 (2013.01); H04L 5/001 (2013.01); H04L 5/0091 (2013.01); H04L 12/1403 (2013.01); H04L 12/1425 (2013.01); H04M 15/49 (2013.01); H04M 15/60 (2013.01); H04M 15/70 (2013.01); H04M 15/73 (2013.01); H04M 15/8214 (2013.01); H04W 84/045 (2013.01);
Abstract

Methods and apparatus, including computer program products, are provided for charging in multi-connectivity systems. In some example embodiments, there may be provided a method that includes marking, by a first base station serving a user equipment, at least one packet to include a first indication indicating that the at least one packet was received directly at the first base station serving the user equipment; and marking, by the first base station, at least one other packet to include a second indication to indicate that the at least one other packet was received via a second base station also serving the user equipment. Related systems, methods, and articles of manufacture are also described.


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