The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Nov. 13, 2019
Applicant:

Aeponyx Inc., Montreal, CA;

Inventors:

Francois Menard, Trois-Rivieres, CA;

Martin Berard, Repentigny, CA;

Jonathan Briere, Terrabonne, CA;

Assignee:

Aeponyx Inc., Montreal, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04J 14/00 (2006.01); H04Q 11/00 (2006.01); H04J 14/02 (2006.01); H04Q 11/02 (2006.01); H04L 12/64 (2006.01); G02B 6/35 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
H04Q 11/0005 (2013.01); G02B 6/3518 (2013.01); H04J 14/02 (2013.01); H04L 12/6418 (2013.01); H04Q 11/0062 (2013.01); H04Q 11/02 (2013.01); G02B 2006/12145 (2013.01); H04Q 2011/003 (2013.01); H04Q 2011/0016 (2013.01); H04Q 2011/0039 (2013.01); H04Q 2011/0058 (2013.01); H04Q 2011/0073 (2013.01);
Abstract

Data center interconnections, which encompass WSCs as well as traditional data centers, have become both a bottleneck and a cost/power issue for cloud computing providers, cloud service providers and the users of the cloud generally. Fiber optic technologies already play critical roles in data center operations and will increasingly in the future. The goal is to move data as fast as possible with the lowest latency with the lowest cost and the smallest space consumption on the server blade and throughout the network. Accordingly, it would be beneficial for new fiber optic interconnection architectures to address the traditional hierarchal time-division multiplexed (TDM) routing and interconnection and provide reduced latency, increased flexibility, lower cost, lower power consumption, and provide interconnections exploiting scalable optical modular optically switched interconnection network as well as temporospatial switching fabrics allowing switching speeds below the slowest switching element within the switching fabric.


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