The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Nov. 07, 2018
Applicants:

Mohannad Elsayad, Verdun, CA;

Frederic Nabki, Montreal, CA;

Anoir Bouchami, Saint-Leonard, CA;

Inventors:

Mohannad Elsayad, Verdun, CA;

Frederic Nabki, Montreal, CA;

Anoir Bouchami, Saint-Leonard, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/24 (2006.01); H03F 3/45 (2006.01); H03G 3/30 (2006.01); H03H 3/007 (2006.01); H03B 5/36 (2006.01); B81C 1/00 (2006.01); G01C 19/5684 (2012.01); H03G 1/00 (2006.01); G01C 19/5656 (2012.01); H03K 5/24 (2006.01); G01C 19/5663 (2012.01);
U.S. Cl.
CPC ...
H03H 9/02433 (2013.01); B81C 1/00 (2013.01); G01C 19/5684 (2013.01); H03B 5/364 (2013.01); H03F 3/45475 (2013.01); H03G 1/0029 (2013.01); H03G 3/30 (2013.01); H03H 3/0072 (2013.01); H03H 9/02338 (2013.01); H03H 9/02409 (2013.01); H03H 9/2436 (2013.01); G01C 19/5656 (2013.01); G01C 19/5663 (2013.01); H03B 5/36 (2013.01); H03F 2200/435 (2013.01); H03G 2201/103 (2013.01); H03H 2009/0244 (2013.01); H03H 2009/02354 (2013.01); H03H 2009/02385 (2013.01); H03H 2009/02456 (2013.01); H03H 2009/02503 (2013.01); H03H 2009/241 (2013.01); H03H 2009/2442 (2013.01); H03K 5/24 (2013.01);
Abstract

Reference oscillators are ubiquitous in timing applications generally, and in modern wireless communication devices particularly. Microelectromechanical system (MEMS) resonators are of particular interest due to their small size and potential for integration with other MEMS devices and electrical circuits on the same chip. In order to support their use in high volume low cost applications it would be beneficial for MEMS designers to have MEMS resonator designs and manufacturing processes that whilst employing low cost low resolution semiconductor processing yield improved resonator performance thereby reducing the requirements of the oscillator circuitry. It would be further beneficial for the oscillator circuitry to be able to leverage the improved noise performance of differential TIAs without sacrificing power consumption.


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