The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Nov. 26, 2018
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventors:
Assignee:
YAZAKI CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/10 (2006.01); H01R 43/02 (2006.01); B23K 20/00 (2006.01); H01R 43/28 (2006.01); B23K 101/38 (2006.01); H01R 4/18 (2006.01);
U.S. Cl.
CPC ...
H01R 43/0207 (2013.01); B23K 20/004 (2013.01); B23K 20/10 (2013.01); H01R 43/28 (2013.01); B23K 2101/38 (2018.08); H01L 2224/85205 (2013.01); H01R 4/184 (2013.01);
Abstract
An ultrasonic bonding method of a conductor of an electric wire includes ultrasonically bonding strands forming a conductor of at least one electric wire using an anvil and horns. A first vibration mode of at least one of the horns is different from a second vibration mode of the other horns.