The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

May. 12, 2020
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Shunpei Yamazaki, Setagaya, JP;

Masakatsu Ohno, Utsunomiya, JP;

Hiroki Adachi, Tochigi, JP;

Satoru Idojiri, Tochigi, JP;

Koichi Takeshima, Sano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); B23K 26/08 (2014.01); H01L 51/00 (2006.01); H01L 29/786 (2006.01); B23K 26/06 (2014.01); H01L 27/12 (2006.01); B23K 26/0622 (2014.01); H01L 51/52 (2006.01); H01L 29/24 (2006.01); H01L 51/56 (2006.01); H01L 29/66 (2006.01); B23K 26/04 (2014.01); H01L 41/314 (2013.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3272 (2013.01); B23K 26/04 (2013.01); B23K 26/0617 (2013.01); B23K 26/0622 (2015.10); B23K 26/0643 (2013.01); B23K 26/0648 (2013.01); B23K 26/083 (2013.01); H01L 27/1225 (2013.01); H01L 27/1266 (2013.01); H01L 27/322 (2013.01); H01L 27/3258 (2013.01); H01L 27/3262 (2013.01); H01L 29/24 (2013.01); H01L 29/66969 (2013.01); H01L 29/7869 (2013.01); H01L 29/78603 (2013.01); H01L 51/003 (2013.01); H01L 51/0024 (2013.01); H01L 51/0027 (2013.01); H01L 51/0097 (2013.01); H01L 51/5246 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 27/3244 (2013.01); H01L 41/314 (2013.01); H01L 51/5096 (2013.01); H01L 51/5284 (2013.01); H01L 2227/323 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/558 (2013.01); Y02E 10/549 (2013.01); Y02P 70/50 (2015.11);
Abstract

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.


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