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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10879329 B1

PDFFull Text
Date of Patent:
Dec. 29, 2020

Filed:

Feb. 12, 2019

Semiconductor device, semiconductor substrate, luminescent unit, and display unit

Applicant:

Joled Inc., Tokyo, JP;

Inventors:

Tokuaki Kuniyoshi, Tokyo, JP;

Naoki Asano, Tokyo, JP;

Ryo Koshiishi, Tokyo, JP;

Hiroshi Fujimura, Tokyo, JP;

Assignee:

JOLED INC., Tokyo, JP;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Sonya McCall-Shepard

Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 29/786 (2006.01); H01L 27/12 (2006.01); H01L 27/07 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/4763 (2006.01); H01L 21/027 (2006.01); G09G 3/3233 (2016.01);
U.S. Cl.
CPC ...
H01L 27/3262 (2013.01); H01L 27/3265 (2013.01); H01L 27/3276 (2013.01); H01L 29/7869 (2013.01); G09G 3/3233 (2013.01); G09G 2300/0819 (2013.01); H01L 21/0217 (2013.01); H01L 21/0273 (2013.01); H01L 21/02164 (2013.01); H01L 21/02178 (2013.01); H01L 21/02271 (2013.01); H01L 21/47635 (2013.01); H01L 27/124 (2013.01); H01L 27/1218 (2013.01); H01L 27/1225 (2013.01); H01L 27/1255 (2013.01); H01L 27/1262 (2013.01); H01L 27/3211 (2013.01); H01L 29/66969 (2013.01); H01L 2227/323 (2013.01);
Abstract

A semiconductor device includes a base, a first wiring line, a semiconductor film, a second wiring line, an insulating film, and a semiconductor auxiliary layer. The first wiring line is provided in the first, second, and third regions of the base. The semiconductor film has one or more low-resistance regions, is provided between the first wiring line and the base in the first region, and is in contact with the first wiring line in the second region. The second wiring line is in contact with the first wiring line in the third region. The insulating film is provided between the first wiring line and the semiconductor film in the first region. The semiconductor auxiliary layer is in contact with the semiconductor film at least in the first region, and assists electrical coupling via the first region.

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