The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Nov. 28, 2018
Hyundai Autron Co., Ltd., Seoul, KR;
Han Sin Cho, Seoul, KR;
HYUNDAI AUTRON CO., LTD., Seoul, KR;
Abstract
Provided is a power chip integration module including: a first semiconductor chip; a second semiconductor chip; a wiring layer on an upper surface or a lower surface of the first semiconductor chip and the second semiconductor chip to electrically connect the first semiconductor chip and the second semiconductor chip; an internal electrode extending from an internal electrode pad on an upper surface of at least one of the wiring layer, the first semiconductor chip, the second semiconductor chip, and combinations thereof to an external solder pad formed on an installation surface of the first semiconductor chip and the second semiconductor chip; and a first molding member in a shape to surround at least a portion of the first semiconductor chip, the second semiconductor chip, and the internal electrode.