The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Jan. 07, 2019
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Daniel Daeik Kim, Del Mar, CA (US);
Manuel Aldrete, Encinitas, CA (US);
Babak Nejati, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/538 (2013.01); H01L 24/17 (2013.01); H01L 24/49 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/071 (2013.01); H01L 25/074 (2013.01); H01L 25/112 (2013.01); H01L 25/117 (2013.01); H05K 1/023 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15311 (2013.01);
Abstract
An RF/EMI shield has a substrate, a plurality of solder balls on a first side of the substrate, and a plurality of wire-bonds on a periphery of the first side of the substrate to form a shield which can be soldered in a surface mount process directly around components needing shielding. Each of the plurality of wire-bonds has a width selected as a fraction of the wavelength of interest.