The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Aug. 28, 2019
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Fumiaki Takeshita, Esslingen, DE;
Teruaki Nonoyama, Satsumasendai, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 23/15 (2006.01); H01L 23/02 (2006.01); H01L 23/00 (2006.01); H01L 31/0203 (2014.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/02 (2013.01); H01L 23/15 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 31/0203 (2013.01); H01L 33/486 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48227 (2013.01);
Abstract
In one aspect of this disclosure, an electronic device mounting board includes a substrate having a first surface and a second surface opposite to the first surface. The substrate has a first recess located on the first surface and a second recess located on the second surface. The substrate includes an electrode pad. The electrode pad is located in the first recess. The second recess in the substrate contains a reinforcement dividing the second recess into a plurality of recesses. The reinforcement is located separate from the electrode pad or is located to overlap the electrode pad in a plan view.