The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Dec. 26, 2018
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Kai Liu, San Diego, CA (US);

Gang Lin, San Diego, CA (US);

Assignee:

Qualcomm Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 23/552 (2013.01); H01L 24/17 (2013.01); H01L 28/10 (2013.01); H01L 2224/02371 (2013.01);
Abstract

A power supply package is disclosed, including a power management integrated circuit (PMIC) die with a plurality of switching circuits, and a plurality of integrated 3-dimensional (3D) inductors disposed around the PMIC die. Each 3D inductor corresponds to a switching circuit and is electrically coupled to first and second connections for the corresponding switching circuit. An integrated electromagnetic interference (EMI) shield is disposed between the PMIC and the 3D inductors.


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