The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Dec. 28, 2018
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Dishit Paresh Parekh, Dallas, TX (US);
Benjamin Stassen Cook, Addison, TX (US);
Daniel Lee Revier, Dallas, TX (US);
Jo Bito, Dallas, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/42 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/4871 (2013.01); H01L 21/563 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 24/28 (2013.01); H01L 24/48 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/14 (2013.01);
Abstract
A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.