The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Sep. 19, 2017
Applicant:
Omron Corporation, Kyoto, JP;
Inventor:
Wakahiro Kawai, Kyoto, JP;
Assignee:
OMRON Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H01B 5/14 (2006.01); H01B 13/00 (2006.01); H05K 7/20 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01B 5/14 (2013.01); H01B 13/00 (2013.01); H01L 21/4867 (2013.01); H01L 21/565 (2013.01); H01L 23/49838 (2013.01); H05K 1/02 (2013.01); H05K 3/00 (2013.01); H05K 7/20 (2013.01); H01L 23/293 (2013.01); H01L 23/49866 (2013.01);
Abstract
An electronic device includes electronic components, a molded resin element wherein the electronic components are embedded and secured, and a heat transfer layer; the heat transfer layer has a higher thermal conductivity than the molded resin element. The heat transfer layer is in contact with portions of the electronic components other than an electrode pad and a terminal. This prevents increases in the cost of manufacturing the electronic device and the allows the electronic device to be thinner.