The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
May. 09, 2019
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Hirokazu Yazaki, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 23/29 (2013.01); H01L 23/3135 (2013.01); H01L 23/49805 (2013.01); H01L 23/552 (2013.01); H05K 1/0218 (2013.01); H05K 1/18 (2013.01); H05K 3/4007 (2013.01); H05K 9/0075 (2013.01); H05K 2201/08 (2013.01);
Abstract
An electronic component includes a board, a surface mount device, a nonmagnetic resin layer, a metal shield layer, and a magnetic shield layer. The board includes first and second principal surfaces facing each other, and a magnetic body layer. The surface mount device is mounted on the first principal surface of the board. The nonmagnetic resin layer covers the surface mount device. The metal shield layer covers the nonmagnetic resin layer. The magnetic shield layer covers an entire or substantially an entire surface of the metal shield layer.