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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10879112 B1

PDFFull Text
Date of Patent:
Dec. 29, 2020

Filed:

Mar. 23, 2018

Self-aligned via forming to conductive line and related wiring structure

Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Brent A. Anderson, Jericho, VT (US);

Edward J. Nowak, Shelburne, VT (US);

Assignee:

GlobalFoundries Inc., Grand Cayman, KY;

Attorney:

Hoffman Warnick LLC

Primary Examiner:

Brigitte A Paterson

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 21/3105 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76835 (2013.01); H01L 21/31051 (2013.01); H01L 21/31053 (2013.01); H01L 21/31144 (2013.01); H01L 21/7681 (2013.01); H01L 21/76819 (2013.01); H01L 21/76832 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 21/76897 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/53295 (2013.01); H01L 21/76885 (2013.01);
Abstract

A method of forming a via and a wiring structure formed are disclosed. The method may include forming a conductive line in a first dielectric layer; forming a hard mask adjacent to the conductive line after the conductive line forming; forming a second dielectric layer over the hard mask; and forming a via opening to the conductive line in the second dielectric layer. The via opening lands at least partially on the hard mask to self-align the via opening to the conductive line. A via may be formed by filling the via opening with a conductor.

Find Patent Forward Citations

Anderson, Brent. (2020). Self-aligned via forming to conductive line and related wiring structure (U.S. Patent No. 10879112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10879112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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