The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Aug. 01, 2018
Applicant:
Jian Zhang, Brookline, MA (US);
Inventor:
Jian Zhang, Brookline, MA (US);
Assignee:
Boston Process Technologies, Inc, Peabody, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/68 (2006.01); G06T 7/00 (2017.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); G06T 7/33 (2017.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); G06T 7/001 (2013.01); G06T 7/33 (2017.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/67288 (2013.01); H01L 21/682 (2013.01); H01L 21/6838 (2013.01); H01L 21/68707 (2013.01); H01L 24/11 (2013.01); H01L 24/17 (2013.01); G06T 2207/30148 (2013.01); H01L 2224/11005 (2013.01); H01L 2224/11013 (2013.01); H01L 2224/11334 (2013.01);
Abstract
A system for the flux free processing of a plurality of solder balls on a wafer, comprising: an articulable vacuum support chuck for maintaining support of a plurality of solder balls on a wafer being processed. An articulable flux-free binder applicator arranged in binder depositing relationship with the wafer within the treatment chamber. An articulable fluid dispenser is arranged in a binder-applied minimization-treatment with respect to the flux free binder applied to the wafer within the treatment chamber.