The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Mar. 14, 2018
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventors:
Assignee:
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67075 (2013.01); H01L 21/31144 (2013.01); H01L 21/32134 (2013.01); H01L 21/32139 (2013.01); H01L 21/6708 (2013.01); H01L 21/67046 (2013.01); H01L 21/67086 (2013.01);
Abstract
According to an embodiment, a substrate treatment apparatus includes a hair member including a noble metal, and a liquid chemical supply member to supply a liquid chemical. While a tip part of the hair member is contact with a predetermined surface of a metal, the liquid chemical is supplied onto the surface of the metal, and the metal is removed with etching.
Quick Actions:
Yoshimizu, Yasuhito. (2020). Substrate treatment apparatus and manufacturing method of semiconductor device (U.S. Patent No. 10879087). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10879087
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile