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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10878988 B1

PDFFull Text
Date of Patent:
Dec. 29, 2020

Filed:

Sep. 24, 2019

Method of manufacturing a coil electronic component

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Hyung Ho Kim, Suwon-si, KR;

Yong Suk Kim, Suwon-si, KR;

Gun Se Chang, Suwon-si, KR;

Young Seuck Yoo, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Paul D Kim

Int. Cl.
CPC ...
H01F 7/06 (2006.01); H01F 27/255 (2006.01); H01F 27/26 (2006.01); H01F 27/245 (2006.01); H01F 17/04 (2006.01); H01F 41/061 (2016.01); H01F 41/076 (2016.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 41/02 (2006.01); H01F 3/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); H01F 17/04 (2013.01); H01F 27/245 (2013.01); H01F 27/263 (2013.01); H01F 27/2828 (2013.01); H01F 27/292 (2013.01); H01F 41/0233 (2013.01); H01F 41/0246 (2013.01); H01F 41/061 (2016.01); H01F 41/076 (2016.01); H01F 2003/106 (2013.01); H01F 2017/046 (2013.01); H01F 2017/048 (2013.01);
Abstract

A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.

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Kim, Hyung. (2020). Method of manufacturing a coil electronic component (U.S. Patent No. 10878988). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10878988

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