The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Jan. 21, 2020
Applicant:
Stmicroelectronics (Rousset) Sas, Rousset, FR;
Inventors:
Pascal Fornara, Pourrieres, FR;
Christian Rivero, Rousset, FR;
Assignee:
STMicroelectronics (Rousset) SAS, Rousset, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01); G11C 16/22 (2006.01); G06F 21/87 (2013.01); H01L 21/311 (2006.01); H01L 21/74 (2006.01); H01L 21/8238 (2006.01); H01L 23/00 (2006.01); H01L 27/115 (2017.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
G11C 16/22 (2013.01); G06F 21/87 (2013.01); H01L 21/31116 (2013.01); H01L 21/74 (2013.01); H01L 21/76829 (2013.01); H01L 21/76898 (2013.01); H01L 21/823475 (2013.01); H01L 21/823481 (2013.01); H01L 21/823892 (2013.01); H01L 22/14 (2013.01); H01L 22/34 (2013.01); H01L 23/57 (2013.01); H01L 23/576 (2013.01); H01L 27/115 (2013.01); H01L 29/7846 (2013.01);
Abstract
The thinning of a semiconductor substrate of an integrated circuit from a back face is detected using the measurement of a physical quantity representative of the resistance between the ends of two electrically-conducting contacts situated at an interface between an insulating region and an underlying substrate region. The two electrically-conducting contacts extend through the insulating region to reach the underlying substrate region.