The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Nov. 21, 2014
Applicant:
Toho Tenax Co., Ltd., Tokyo, JP;
Inventor:
Toru Kaneko, Shizuoka, JP;
Assignee:
TOHO TENAX CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08L 101/00 (2006.01); C08L 33/12 (2006.01); C08L 33/06 (2006.01); C08G 59/40 (2006.01); B29C 65/02 (2006.01); B29C 70/12 (2006.01); B29C 70/34 (2006.01); B29C 70/44 (2006.01); C08J 5/04 (2006.01); C08L 31/02 (2006.01); C08L 63/04 (2006.01); B29K 663/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B29C 65/02 (2013.01); B29C 70/12 (2013.01); B29C 70/342 (2013.01); B29C 70/44 (2013.01); C08G 59/4021 (2013.01); C08J 5/042 (2013.01); C08L 31/02 (2013.01); C08L 33/06 (2013.01); C08L 33/12 (2013.01); C08L 63/00 (2013.01); C08L 63/04 (2013.01); C08L 101/00 (2013.01); B29K 2663/00 (2013.01); C08J 2331/02 (2013.01); C08J 2363/00 (2013.01); C08J 2363/02 (2013.01); C08J 2363/04 (2013.01); C08J 2431/02 (2013.01); C08J 2433/00 (2013.01); C08J 2433/06 (2013.01); C08J 2463/02 (2013.01); C08L 2205/02 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C08L 2205/035 (2013.01);
Abstract
The present invention provides a heat-curable resin composition, which comprises (1) a heat-curable resin mixture comprising a heat-curable resin (a) and thickener particles (b) and exhibiting a viscosity (150° C.) after having been held at a temperature of 150° C. for 30 seconds that is a viscosity (S), and (2) a curing agent, and is characterized in that the heat-curable resin composition exhibits a lowest viscosity (R) at 80-120° C., the lowest viscosity (R) is 0.1-10 Pa·s, and the viscosity (S) and lowest viscosity (R) satisfy the relationship of formula (1):5<<200  formula (1).