The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Jul. 08, 2019
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

James Michael Gardner, Corvallis, OR (US);

Scott A. Linn, Corvallis, OR (US);

Stephen D. Panshin, Corvallis, OR (US);

Jefferson P. Ward, Vancouver, WA (US);

David Owen Roethig, Vancouver, WA (US);

David N. Olsen, Corvallis, OR (US);

Anthony D. Studer, Corvallis, OR (US);

Michael W. Cumbie, Corvallis, OR (US);

Sirena Chi Lu, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/175 (2006.01); G01L 23/08 (2006.01); B41J 29/393 (2006.01);
U.S. Cl.
CPC ...
B41J 2/17546 (2013.01); B41J 2/1752 (2013.01); B41J 2/17526 (2013.01); B41J 29/393 (2013.01); G01L 23/08 (2013.01);
Abstract

A sensor circuit for a replaceable print material container to be connected to a host print apparatus logic circuit comprising a first sensor to detect a pneumatic stimulus or pressurization applied by a print apparatus, and an interface including contact pads to connect to a voltage and/or data source of the print apparatus logic circuit, the sensor circuit configured to output signals conditioned by the pneumatic stimulus or pressurization via the contact pads.


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