The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Jan. 10, 2018
The Boeing Company, Chicago, IL (US);
Gabriel Z. Forston, Lake Stevens, WA (US);
Christopher G. Harris, Auburn, WA (US);
Joshua P. Tyndall, Everett, WA (US);
Hyukbong Kwon, Mukilteo, WA (US);
Carolyn Schmidt, Scottsdale, AZ (US);
The Boeing Company, Chicago, IL (US);
Abstract
A method of making a joint for a structure comprises forming a thermoplastic filler, applying an uncured first thermoset layer into direct contact with the thermoplastic filler, applying an uncured second thermoset layer into direct contact with the thermoplastic filler, and applying an uncured third thermoset layer into direct contact with the thermoplastic filler. The method additionally comprises curing the uncured first thermoset layer, the uncured second thermoset layer, and the uncured third thermoset layer at a temperature below a melting temperature of the thermoplastic material to form a cured first thermoset layer, a cured second thermoset layer, and a cured third thermoset layer and bonding together the cured first thermoset layer, the cured second thermoset layer, the cured third thermoset layer, and the thermoplastic filler.