The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Sep. 20, 2018
Nichia Corporation, Anan, JP;
Teppei Kunimune, Tokushima, JP;
NICHIA CORPORATION, Anan, JP;
Abstract
The present disclosure provides a method for bonding an electronic component and a method for manufacturing a bonded body, which are capable of sintering a silver paste at a comparatively low temperature. Disclosed is a method for bonding an electronic component using a silver paste containing silver particles, the method including: applying a silver paste containing silver particles on a surface of a substrate and setting electronic components on the silver paste applied, heating in a reducing atmosphere at a temperature of lower than 300° C., and after heating in the reducing atmosphere, heating in an oxidizing atmosphere at a temperature of 300° C. or lower.