The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Feb. 18, 2016
Applicant:

Avic Beijing Aeronautical Manufacturing Technology Research Institute, Beijing, CN;

Inventors:

Aaron C. L. Lam, London, GB;

Zhusheng Shi, London, GB;

Xia Huang, Beijing, CN;

Yuansong Zeng, Beijing, CN;

Zhiqiang Li, Beijing, CN;

Jianguo Lin, London, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 37/02 (2006.01); B21D 22/02 (2006.01);
U.S. Cl.
CPC ...
B21D 37/02 (2013.01); B21D 22/022 (2013.01);
Abstract

A die mechanism comprises a first support member and a second support member, the first and second support members extending in a first direction; a plurality of pin modules between the first and second support members, wherein each of the plurality of pin modules extends in a second direction perpendicular to the first direction, and each pin module comprises a plurality of pins; wherein heights of ends of the plurality of pins within each of the plurality of pin modules together define a shape profile for shaping the component during creep-age forming; and wherein: the plurality of pin modules are configured to be movable along the first and second support members in the first direction, and/or the plurality of pins are configured to be movable along respective pin modules in the second direction.


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