The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2020

Filed:

Sep. 23, 2019
Applicant:

Ford Global Technologies, Llc, Dearborn, MI (US);

Inventors:

Man Prakash Gupta, Dearborn, MI (US);

Michael W. Degner, Dearborn, MI (US);

Edward Chan-Jiun Jih, Troy, MI (US);

Alfredo R. Munoz, Ann Arbor, MI (US);

Assignee:

Ford Global Technologies, LLC, Dearborn, MI (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 25/11 (2006.01); H02M 7/00 (2006.01); H02M 7/5387 (2007.01); H02P 27/06 (2006.01); B60K 6/28 (2007.10); B60L 58/26 (2019.01); B60L 50/60 (2019.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H01L 23/473 (2013.01); H01L 25/115 (2013.01); H02M 7/003 (2013.01); H02M 7/5387 (2013.01); H05K 7/20272 (2013.01); H05K 7/20872 (2013.01); B60K 6/28 (2013.01); B60L 50/60 (2019.02); B60L 58/26 (2019.02); B60Y 2200/91 (2013.01); B60Y 2200/92 (2013.01); B60Y 2306/05 (2013.01); B60Y 2400/112 (2013.01); H02P 27/06 (2013.01);
Abstract

A power-module assembly includes a plurality of power modules each including a power stage having a substrate and a transistor-based switching arrangement supported on the substrate. The power modules are arranged in a stack that defines coolant chambers interleaved with the power stages and defines a pair of coolant-supply manifolds disposed on opposing sides of the stack and extending along a length of the stack. For each power module, the substrate defines a network of cooling channels connecting the supply manifolds to a corresponding one of the chambers. The network includes first channels each configured to receive coolant from the pair of coolant-supply manifolds, second channels substantially parallel to the first channels and each opening into the corresponding one of the chambers, and third channels crisscrossing the first and second channels to connect the first and second channels in fluid communication.


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