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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10874020 B1

PDFFull Text
Date of Patent:
Dec. 22, 2020

Filed:

Feb. 08, 2019

Imprinted metallization on polymeric substrates

Applicant:

The University of Hong Kong, Hong Kong, CN;

Inventors:

Wendi Li, Hong Kong, CN;

Jingxuan Cai, Guangdong, CN;

Shien-Ping Feng, Hong Kong, CN;

Mingyang Zhang, Hong Kong, CN;

Assignee:

THE UNIVERSITY OF HONG KONG, Hong Kong, CN;

Attorney:

Leydig, Voit & Mayer, Ltd.

Primary Examiner:

Hai Y Zhang

Int. Cl.
CPC ...
B05D 1/00 (2006.01); H05K 3/18 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/38 (2006.01); H01B 5/14 (2006.01); H01B 13/00 (2006.01); G03F 7/00 (2006.01); C23C 18/16 (2006.01); H05K 3/10 (2006.01); G02B 1/00 (2006.01); H05K 1/18 (2006.01); H01B 1/02 (2006.01); H01L 33/28 (2010.01); H01L 33/42 (2010.01); H01L 33/00 (2010.01); B82Y 40/00 (2011.01); B82Y 20/00 (2011.01);
U.S. Cl.
CPC ...
H05K 3/182 (2013.01); C23C 18/1608 (2013.01); G03F 7/0035 (2013.01); H01B 5/14 (2013.01); H01B 13/0036 (2013.01); H05K 1/028 (2013.01); H05K 1/09 (2013.01); H05K 3/107 (2013.01); H05K 3/381 (2013.01); B82Y 20/00 (2013.01); B82Y 40/00 (2013.01); G02B 1/002 (2013.01); H01B 1/02 (2013.01); H01L 33/0083 (2013.01); H01L 33/28 (2013.01); H01L 33/42 (2013.01); H01L 2933/0016 (2013.01); H05K 1/189 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10522 (2013.01); H05K 2203/0121 (2013.01); H05K 2203/072 (2013.01);
Abstract

A method for selective metallization includes: selectively adsorbing catalytic nanoparticles onto an imprint mold to form a selectively adsorbed catalytic nanoparticle (SACN) mold; using the SACN mold in an imprinting process to synchronously transfer a pattern and the catalytic nanoparticles onto a film; separating the film from the SACN mold; and selectively depositing metal onto the film based on the pattern transferred to the film.

Find Patent Forward Citations

Quick Actions:

Li, Wendi. (2020). Imprinted metallization on polymeric substrates (U.S. Patent No. 10874020). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10874020

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