The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2020

Filed:

May. 29, 2019
Applicant:

Amphenol Corporation, Wallingford, CT (US);

Inventors:

Zlatan Ljubijankic, Mississauga, CA;

Barbara H. Marten, Toronto, CA;

Alfranco Salcedo, North Bergen, NJ (US);

Assignee:

Amphenol Corporation, Wallingford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/502 (2006.01); H01R 13/6471 (2011.01); H01R 13/62 (2006.01); H01R 43/24 (2006.01); H01R 13/405 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6471 (2013.01); H01R 13/405 (2013.01); H01R 13/502 (2013.01); H01R 13/62 (2013.01); H01R 43/24 (2013.01);
Abstract

An electrical connector, and method of assembly, that has a conductive connector shell and a contact subassembly received therein. The contact subassembly has first and second signal wafers and a ground wafer sandwiched between the signal wafers. Each of the signal wafers includes one or more signal contacts and a dielectric wafer body formed around the signal contacts such that the tail and mating ends of the signal contacts are outside of the wafer body. The ground wafer includes one or more ground contacts and a dielectric wafer body formed around the ground contacts such that the tail ends of the ground contacts are outside of the wafer body of the ground wafer.


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