The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2020

Filed:

Dec. 17, 2019
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Wooyong Sung, Yongin-si, KR;

Wonwoo Choi, Yongin-si, KR;

Sooyoun Kim, Yongin-si, KR;

Junghan Seo, Yongin-si, KR;

Seoyeon Lee, Yongin-si, KR;

Hyoungsub Lee, Yongin-si, KR;

Moonwon Chang, Yongin-si, KR;

Seunggun Chae, Yongin-si, KR;

Seungyong Song, Yongin-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); H01L 27/32 (2006.01); H01L 21/762 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); G06F 3/0412 (2013.01); G06F 3/0443 (2019.05); H01L 21/76205 (2013.01); H01L 27/323 (2013.01); H01L 27/3246 (2013.01); H01L 27/3258 (2013.01); H01L 51/0097 (2013.01); H01L 51/5237 (2013.01); H01L 2251/5338 (2013.01);
Abstract

A display device includes: a substrate that includes an opening and a display area that surrounds the opening; a plurality of grooves formed in the substrate between the opening and the display area; a display element layer on the substrate and that includes a plurality of display elements in the display area; a thin-film encapsulation layer disposed on the display element layer, the thin-film encapsulation layer including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer which are sequentially stacked; a planarization layer disposed over the plurality of grooves and that includes an organic insulating material, wherein the planarization layer is disposed over the second inorganic encapsulation layer, and the organic encapsulation layer is disposed below the second inorganic encapsulation layer.


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