The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Oct. 29, 2019
Jiaxing Super Lighting Electric Appliance Co., Ltd, Jiaxing, CN;
Tao Jiang, Jiaxing, CN;
Weihong Xu, Jiaxing, CN;
Yukihiro Saito, Jiaxing, CN;
Hayato Unagike, Jiaxing, CN;
Aiming Xiong, Jiaxing, CN;
Junfeng Xu, Jiaxing, CN;
Yiching Chen, Taichung, TW;
J1AXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD, Jiaxing, CN;
Abstract
An LED light bulb, comprising of: a lamp housing; a bulb base connected to the lamp housing; a stem connected to the bulb base and located in the lamp housing; a single flexible LED filament, disposed in the lamp housing, the flexible LED filament comprising: a plurality of LED sections; a plurality of conductive sections, located between the adjacent two LED sections, where each of the conductive sections includes a conductor, the conductor is copper foil; at least two conductive electrodes; and a light conversion layer comprising a phosphor layer and a silicon layer superposed on the phosphor layer, disposed on the LED chips and at least two sides of the conductive electrodes, and a portion of the conductive electrodes is exposed by the light conversion layer, the LED chip comprising a upper surface and a lower surface opposite to the upper surface of the LED chip, the phosphor layer directly contacts the upper surface of the LED chip, and a base layer contacts the lower surface of the LED chip; the base layer is formed from organosilicon-modified polyimide resin composition comprising an organosilicon-modified polyimide and a thermal curing agent.