The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2020

Filed:

Apr. 20, 2020
Applicant:

Tessera, Inc., San Jose, CA (US);

Inventors:

Effendi Leobandung, Stormville, CA (US);

Tenko Yamashita, Schenectady, NY (US);

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 21/308 (2006.01); H01L 21/306 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/165 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0673 (2013.01); H01L 21/02603 (2013.01); H01L 21/3085 (2013.01); H01L 21/3086 (2013.01); H01L 21/30604 (2013.01); H01L 21/823807 (2013.01); H01L 21/823828 (2013.01); H01L 21/823857 (2013.01); H01L 27/092 (2013.01); H01L 29/0665 (2013.01); H01L 29/0676 (2013.01); H01L 29/165 (2013.01); H01L 29/42392 (2013.01); H01L 29/6656 (2013.01); H01L 29/66545 (2013.01); H01L 29/66742 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/78696 (2013.01); H01L 21/823814 (2013.01); H01L 21/823842 (2013.01); H01L 21/823864 (2013.01); H01L 29/49 (2013.01);
Abstract

A method for forming active regions of a semiconductor device comprising forming a nanosheet stack on a substrate, forming the nanosheet stack comprising forming a sacrificial nanosheet layer on the substrate, and forming a nanosheet layer on the sacrificial nanosheet layer, forming an etch stop layer on the nanosheet stack, forming a mandrel layer on the etch stop layer, removing portions of the mandrel layer to form a mandrel on the etch stop layer, forming sidewalls adjacent to sidewalls of the mandrel, depositing a fill layer on exposed portions of the etch stop layer, removing the sidewalls and removing exposed portions of the etch stop layer and the nanosheet stack to expose portions of the substrate.


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