The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Apr. 24, 2019
Applicant:
Rockley Photonics Limited, London, GB;
Inventors:
Vivek Raghunathan, Mountain View, CA (US);
Vivek Raghuraman, Santa Clara, CA (US);
Karlheinz Muth, Richardson, TX (US);
Assignee:
Rockley Photonics Limited, Oxford, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 31/02 (2006.01); G02B 6/42 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); G02B 6/4274 (2013.01); H01L 24/09 (2013.01); H01L 31/02005 (2013.01); H01L 23/49827 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/023 (2013.01); H01L 2924/1433 (2013.01);
Abstract
An electro-optical package. In some embodiments, the package includes an electronic integrated circuit module, a first electro-optical component, and a photonic integrated circuit. The first electro-optical component may be in a top surface of the photonic integrated circuit. The electronic integrated circuit module may have a top surface facing toward and overlapping both a portion of the first electro-optical component, and a portion of the photonic integrated circuit.