The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2020

Filed:

Sep. 04, 2017
Applicant:

Taniobis Gmbh, Goslar, DE;

Inventors:

Helmut Haas, Boerssum, DE;

Marcel Hagymasi, Goslar, DE;

Kamil Paul Rataj, Duesseldorf, DE;

Christoph Schnitter, Holle, DE;

Markus Weinmann, Goslar, DE;

Assignee:

TANIOBIS GMBH, Goslar, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/052 (2006.01); B22F 3/105 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); C22C 27/02 (2006.01); B29C 64/153 (2017.01); B22F 5/00 (2006.01); C22C 1/04 (2006.01);
U.S. Cl.
CPC ...
H01G 9/052 (2013.01); B22F 3/1055 (2013.01); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); C22C 27/02 (2013.01); B22F 5/00 (2013.01); B22F 2999/00 (2013.01); C22C 1/045 (2013.01);
Abstract

A method for producing an electrical component via a 3D printing includes preparing a first layer which includes a valve metal powder, consolidating at least a portion of the valve metal powder of the first layer via a first selective irradiation with a laser, applying a second layer which includes the valve metal powder to the first layer, consolidating at least a portion of the valve metal powder of the second layer via a second selective irradiation with the laser so as to form a composite of the first layer and of the second layer, applying respective additional layers which include the valve metal powder to the composite, and consolidating at least a portion of the valve metal powder of the respective additional layers via a respective additional selective irradiation with the laser to thereby obtain the electrical component.


Find Patent Forward Citations

Loading…