The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2020

Filed:

Jul. 11, 2017
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Tae Bong Park, Seoul, KR;

Jun Taek Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 3/10 (2006.01); G02B 7/09 (2006.01); H04N 5/225 (2006.01); H04N 5/335 (2011.01);
U.S. Cl.
CPC ...
G03B 3/10 (2013.01); G02B 7/09 (2013.01); H04N 5/2254 (2013.01); G03B 2205/0069 (2013.01); H04N 5/335 (2013.01);
Abstract

An embodiment comprises: a housing; a bobbin, accommodated inside the housing, for mounting a lens; a first coil arranged on an outer peripheral surface of the bobbin; magnets arranged in the housing; a coil board which comprises second coils arranged below the housing and arranged so as to be spaced from each other and connection parts connected to the second coils; a circuit board, which is arranged below the coil board and comprises first pad parts arranged at locations corresponding to the connection parts; and a conductive adhesive member for bonding the connection part and the first pad part, which correspond to each other, wherein each of the connection parts comprises a groove part depressed from the outer surface of the coil board, and exposing any one corresponding upper surface among the first pad parts, and a bonding part prepared around the groove part, and the conductive adhesive member is arranged on the upper surface of the bonding part and on the upper surface of the first pad part exposed by the groove part and electrically connects the bonding part with the first pad part.


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