The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2020

Filed:

Dec. 27, 2018
Applicant:

Fanuc Corporation, Yamanashi, JP;

Inventor:

Fuyuki Ueno, Yamanashi, JP;

Assignee:

FANUC CORPORATION, Yamanashi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/28 (2006.01); G01N 17/00 (2006.01); H05K 1/18 (2006.01); G01R 27/02 (2006.01); G01R 27/26 (2006.01); G01R 27/00 (2006.01); G01R 19/00 (2006.01); G01R 31/50 (2020.01); G01R 27/08 (2006.01); G01R 31/52 (2020.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G01N 17/006 (2013.01); G01R 19/0092 (2013.01); G01R 27/00 (2013.01); G01R 27/02 (2013.01); G01R 27/08 (2013.01); G01R 27/26 (2013.01); G01R 27/2605 (2013.01); G01R 27/28 (2013.01); G01R 31/50 (2020.01); G01R 31/52 (2020.01); H05K 1/181 (2013.01); H05K 7/1427 (2013.01); H05K 7/20136 (2013.01); H05K 2201/10151 (2013.01);
Abstract

An object is to provide a deterioration detection sensor of a printed wiring board in which the accuracy of detection is enhanced. A deterioration detection sensor of a printed wiring board is a circuit board which is vertically provided on a printed wiring board, and is soldered to the printed wiring board with a soldering portion at a lower end. The deterioration detection sensor includes a detection surface for detecting a foreign material. The detection surface forms an intersection surface which intersects the planar direction of the printed wiring board. In the deterioration detection sensor as described above, a wiring in the detection surface is broken, and thus the foreign material is detected.


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