The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2020

Filed:

Jul. 28, 2016
Applicants:

Nidec Corporation, Kyoto, JP;

National University Corporation Yokohama National University, Kanagawa, JP;

Inventors:

Quing Yu, Kanagawa, JP;

Tatsuya Noda, Kanagawa, JP;

Shunichi Tanaka, Kanagawa, JP;

Yoshinobu Nakamura, Kyoto, JP;

Masato Nakanishi, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); H02K 9/19 (2006.01); F28F 3/08 (2006.01); H02K 9/20 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0233 (2013.01); F28D 15/02 (2013.01); F28D 15/0241 (2013.01); F28D 15/0266 (2013.01); F28F 3/086 (2013.01); H02K 9/19 (2013.01); H02K 9/20 (2013.01); F28D 2015/0291 (2013.01); F28D 2021/004 (2013.01); F28D 2021/0028 (2013.01); F28F 2265/12 (2013.01); F28F 2265/14 (2013.01);
Abstract

A cooling device and a motor are provided. The cooling device that cools a heating element is provided with: a cooling chamber for cooling the heating element with a first cooling medium; a radiator chamber for releasing the heat of the first cooling medium to the outside; and a first connection path and a second connection path for connecting the cooling chamber and the radiator chamber. When part of the first cooling medium in the cooling chamber is gasified, at least part of the gasified first cooling medium moves into the first connection path, thus causing a circulation in which the first cooling medium in the cooling chamber flows into the radiator chamber via the first connection path, and the first cooling medium in the radiator chamber flows into the cooling chamber via the second connection path.


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