The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2020

Filed:

Jan. 30, 2019
Applicant:

Wenhui Jiang, Pearland, TX (US);

Inventor:

Wenhui Jiang, Pearland, TX (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/52 (2006.01); C04B 35/645 (2006.01); B01J 3/08 (2006.01); E21B 10/567 (2006.01);
U.S. Cl.
CPC ...
C04B 35/52 (2013.01); B01J 3/08 (2013.01); C04B 35/645 (2013.01); E21B 10/567 (2013.01); B01J 2203/0655 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/405 (2013.01); C04B 2235/427 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/656 (2013.01);
Abstract

A polycrystalline diamond and a polycrystalline diamond compact comprise nanostructured polycrystalline diamond particles (aggregates) and binder material. The nanostructured polycrystalline diamond particles (aggregates) are from starting raw materials of nanostructured polycrystalline diamond particles (aggregates) with a size of between 1 μm-40 μm. The polycrystalline diamond and the polycrystalline diamond compact may comprise micrometer-sized monocrystalline diamond particles. The binder material in the polycrystalline diamond or the polycrystalline diamond compact may be removed partially or completely by a leaching process. The method of making the polycrystalline diamond or the polycrystalline diamond compact comprises sintering diamond particles comprising the nanostructured polycrystalline diamond particles (aggregates) with a size of between 1 μm-40 μm under high temperature and high pressure in the presence of the binder material.


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