IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10870224 B1

PDFFull Text
Date of Patent:
Dec. 22, 2020

Filed:

Jan. 03, 2018

Method of manufacturing antireflection film

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Daiki Wakizaka, Kanagawa, JP;

Ayako Matsumoto, Kanagawa, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorneys:

Edwards Neils LLC

Jean C. Edwards, Esq.

Primary Examiner:

Timothy Kennedy

Assistant Examiner:

Alexander A Wang

Int. Cl.
CPC ...
B29C 41/12 (2006.01); B32B 5/16 (2006.01); B32B 27/20 (2006.01); G02B 1/118 (2015.01); B29C 41/22 (2006.01); B29C 41/42 (2006.01); G02B 1/111 (2015.01); B32B 38/10 (2006.01); B32B 38/08 (2006.01); G02B 7/00 (2006.01); B29K 71/00 (2006.01); B29K 509/08 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 41/12 (2013.01); B29C 41/22 (2013.01); B29C 41/42 (2013.01); B32B 5/16 (2013.01); B32B 27/20 (2013.01); G02B 1/111 (2013.01); G02B 1/118 (2013.01); B29K 2071/00 (2013.01); B29K 2509/08 (2013.01); B29L 2007/00 (2013.01); B32B 38/08 (2013.01); B32B 38/10 (2013.01); B32B 2457/20 (2013.01); G02B 7/00 (2013.01);
Abstract

Provided is a method of manufacturing an antireflection film including, in order: a step () of providing a layer (a) containing a curable compound (a1) and a particle (a2) having an average primary particle diameter of 100 nm to 380 nm and a layer (b) containing a compound (b1) incompatible with the curable compound (a1) so that the particle (a2) is buried in a layer defined by combining the layer (a) and the layer (b), on a substrate; a step () of curing the layer (a) in a state in which the particle (a2) is buried in the layer defined by combining the layer (a) and the layer (b); and a step () of removing the layer (b) to form an uneven shape on a surface of the layer (a) with the particle (a2).

Find Patent Forward Citations

Loading…