The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Oct. 09, 2018
Applicant:

The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US);

Inventors:

Zhenan Bao, Stanford, CA (US);

Jiheong Kang, Palo Alto, CA (US);

Donghee Son, Palo Alto, CA (US);

Orestis Vardoulis, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/20 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 3/38 (2006.01); H05K 3/40 (2006.01); H01R 12/00 (2006.01); H05K 1/02 (2006.01); H01R 4/58 (2006.01); H01R 12/62 (2011.01); H01R 107/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H01R 12/00 (2013.01); H05K 1/0283 (2013.01); H05K 1/115 (2013.01); H05K 1/118 (2013.01); H05K 3/386 (2013.01); H05K 3/4076 (2013.01); H01R 4/58 (2013.01); H01R 12/62 (2013.01); H01R 2107/00 (2013.01); H01R 2201/12 (2013.01); H01R 2201/20 (2013.01); H05K 1/189 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0314 (2013.01); H05K 2201/058 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0759 (2013.01); H05K 2203/128 (2013.01);
Abstract

Various embodiments are directed to a method of forming an apparatus including placing a first electronic circuit in contact with a second electronic circuit, wherein each of the first and second electronic circuits have connector circuits configured and arranged to provide an electrical connection between the first and second electronic circuits and are formed with a polymer film that is configured to adhere, via self-healing, to another polymer film. The method further includes, in response to the contact, causing or facilitating the self-healing of the respective polymer films of the first and second electronic circuits, thereby creating the electrical connection therebetween.


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