The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Dec. 04, 2018
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Chun-Wen Paul Huang, Methuen, MA (US);

Lui Lam, Lexington, MA (US);

Mark M. Doherty, Westford, MA (US);

Michael Joseph McPartlin, North Andover, MA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04W 84/12 (2009.01); H03F 3/193 (2006.01); H03F 3/195 (2006.01); H03F 3/24 (2006.01); H04B 7/0413 (2017.01); H01L 21/76 (2006.01); H03F 3/21 (2006.01); H03F 3/191 (2006.01); H03F 3/72 (2006.01);
U.S. Cl.
CPC ...
H04W 84/12 (2013.01); H01L 21/76 (2013.01); H03F 3/191 (2013.01); H03F 3/193 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/245 (2013.01); H03F 3/72 (2013.01); H04B 7/0413 (2013.01); H03F 2200/105 (2013.01); H03F 2200/111 (2013.01); H03F 2200/18 (2013.01); H03F 2200/294 (2013.01); H03F 2200/408 (2013.01); H03F 2200/417 (2013.01); H03F 2200/451 (2013.01); H03F 2203/7209 (2013.01);
Abstract

In some embodiments, a wireless local area network (WLAN) front-end can be implemented on a semiconductor die having a semiconductor substrate, and a power amplifier implemented on the semiconductor substrate and configured for WLAN transmit operation associated with a frequency range. The semiconductor die can further include a low-noise amplifier (LNA) implemented on the semiconductor substrate and configured for WLAN receive operation associated with the frequency range. The semiconductor die can further include a transmit/receive switch implemented on the semiconductor substrate and configured to support the transmit and receive operations.


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